Alphane Moon@lemmy.ml to Hardware@lemmy.mlEnglish · 3 months agoTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comexternal-linkmessage-square0fedilinkarrow-up11arrow-down10cross-posted to: hardware@lemmy.ml
arrow-up11arrow-down1external-linkTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comAlphane Moon@lemmy.ml to Hardware@lemmy.mlEnglish · 3 months agomessage-square0fedilinkcross-posted to: hardware@lemmy.ml